BGA Inspection AOI Machine Color Image Contrast Technology
| Category | Item | CW-Z588 | CW-Z588L |
| Recognition System | Inspection | Using multiple algorithm synthetically such as WIDM, Color Image contrast technology, Color extracting technology, similarity, two-value handling technology, OCR/OCV, Solder ball inspection, PTH analysis and so on. |
| Camera | Distal and high speed color CCD camera: 20 um (15um,12um,10um for option) |
| Lamp-house | 4 Rings RGBB LED lamp-house,with special coaxial optical for option. |
| FOV | 40.96mm×40.96mm (20um)30.7mm*30.7mm (15um) |
| Image Processing Speed | 0201 Chip | ＜7.6ms |
| Per-image Time | ＜220ms(20um) |
| Inspection Item | Paste Printing Defects | Misaligned, overflow, insufficient, pasting open, stain |
| Components Defects | Missing, shift, skewed, tombstone,billboard, overturned,reversed polarity, wrong, damage |
| Solder Defects | Overflow, insufficient, short solder, stain |
| Wave Solder Inspect | Overflow, insufficient, short solder, excess solder, solder void |
| Mechanism System | PCB conveyor | Left to right(Optional, right to left)PCB fixing: bottom-up, PCB warp correction.Automatic PCB loading and unloading, Adjustable clearance, Conforming SMEMA standard.Orbit clearance: 900±20mm |
| PCB sizes | 50×50mm-400×330mm 50×50mm-510×460mmcan make bigger size according to clients’ demands |
| PCB Thickness | 0.3mm – 3.0mm |
| PCB Warp tolerance | ＜2mm |
| Component clearance | TOP＜50mm,BOP＜75mm |
| X,Y platform & Z axis | Driver | AC server, camera moves in the directions of X/Y |
| Orientation | ＜10um |
| Moving Speed | 500mm/s |
| Operation System | Microsoft Windows 7*64 |
| Controlling & Recognizing | Characteristics | Set template images real time, count data and error gate value automatically. Three marks correction, ,input CAD date locate the templates automatically,the operator can combine algorithms according to the requirement. |
| Operation | Graphic programming, Chinese, English |
| Offline Programming | Offline programming and Offline debugging |
| Controller | Computer | CPU:Intel dual-core, Memory:16G, Harddisk:1TB |
| Display | 19 inch TFT | 22 inch TFT |
| Multi Machine Control | The operator can control multi same machines in the control terminal |
| Others | Machine Dimensions(L*W*H) | 96cm×100cm×158cm | 104cm×110cm×158cm |
| Weight | 710KG | 850KG |
| Power Supply | AC220V, 10%, single phase 5A 50/60HZ, power consumption 1000W with UPS inside |
| Working Environment | Temperature10-40℃, humidity 30-80% RH |
Feature:
1,The new structure design is accord with human body engineering.
2,The software supports the database control, can emote programming and the debugging, and carries on the data collection and the analysis.
3,The software support for offline programming and off-line debugging.
4,Single box multi algorithm combination, the programming interface more concise and clear.
5,The AOI machine can interact directly with NG BUFFER and other machines through the specific communication protocol.
New Light Source Design
The Z588 adopts multi angle Light source design , through different angles of illuminationto sampling the details of the characteristics of the object to be detected, accurately obtain theassembly and welding information posted element,detected the NG accurately.
Solder Ball Inspection Function
Through the surface color, brightness,solder ballshape and color feature to inspect if there is anysolder ball on the PCB. The machine can inspectthe solder ball surround the component,
also caninspect the whole PCB through the inspectionframe.
BGA Inspection Function
This function used before mounting toinspect if there are insufficient solder,missing ball, solder bridge and so on.
More information welcome to contact me:
Skype: s5@smtfly.com
Mobile/Wechat/WhatsApp: +86-136-8490-4990
Contact: Bunny
Product Tags:
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BGA Inspection AOI Automated Optical Inspection Equipment Color Image Contrast Technology Images
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